Category: General

Meet us at OFC in San Diego, where Prof. Peter O’Brien will be giving Short Course SC525 entitled “Photonic and Electronic Packaging – Materials, Processes, Equipment and Reliability”  (Monday 25th March). Check details on the OFC website for registration.

PIXAPP Director, Prof Peter O’Brien, will be speaking at the PIC Summit Europe 2023. On 7th of November I’ll will give more insights on Heterogeneous Integration. Future PIC-based systems will require an indium phosphide based laser and a bunch of silicon transistors. This will likely be integrated on a silicon substrate. Technologies and materials will […]

PIXAPP, in partnership with AIM Photonics, will hold a Special Session on PIC packaging and integration at ECOC 2023, in Glasgow on October 5th 2023. This workshop brings together leading industry and academic speakers who will present their vision on how to address existing and emerging packaging challenges. Speakers will address topics including packaging materials, […]

Meet PIXAPP’s Director at OFC in San Diego in March 2023. Prof. Peter O’Brien will be presenting at Quantum Computing workshop (Sunday 5th) and giving Short Course SC450 in Photonics Manufacturing (Monday 6th)

PIXAPP co-organized with the European Machine Vision Association, the 5th European Machine Vision Forum  at the end of October in Cork. It brought together industry and academic machine vision experts in a unique setting. The aim of the forum is to foster interaction between the machine vision industry and academic research to learn from each […]

PIXAPP, in partnership with PhotonHub Europe and the JEPPIX and ePIXfab pilot lines organised a training course on Integrated Photonic Technologies at ECOC 2022, in Basel, on September 20th 2022. More information on the training, here.

PIXAPP will be exhibiting at PIC International on 9-10 November 2021, in Brussels, Belgium. Visit us to know more about PIXAPP’s offer of Standard Solutions for PIC Packaging. More information and registration HERE

PIXAPP will be exhibiting at ECOC Exhibition, from 13 to 15 September 2021, in Bordeaux, France. ECOC Exhibition is a key meeting place for decision-makers from across the fibre optic communications technology industry. Visit us at booth #1110 in hall 1, to know more about the high-speed gold box offered by the PIXAPP Pilot Packaging Platform, […]

PhotonicLEAP, a European Horizon 2020 collaborative research project, has been awarded over €5 million Euros in funding from the European Commission to develop disruptive technologies that will drive down the cost of integrated photonic packaging and test processes. PhotonicLEAP will develop disruptive wafer-level PIC module integration, packaging and test technologies which will reduce the costs […]

PIXAPP will be exhibiting at Virtual MedtecLIVE & SUMMIT on 20 – 22 April 2021. Visit us to know more about PIXAPP’s capabilities for the medical market, and how we can help your company develop your next-generation of medical devices with photonic integrated circuit packaging and assembly services based on PIXAPP standardised building blocks for […]