PIXAPP Pre-commercial runs: call for proposals

PIXAPP is pleased to announce a call for proposals to support companies develop scalable packaging solutions for their new photonic-based products. Proposals submitted will be reviewed by an internal PIXAPP technical panel, with the expectation to start approved projects in Q1-2021. Click HERE for the main proposal selection criteria and to register for the Pre-Proposal […]

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PIXAPP launches new prototype packaging platforms for early-stage photonic device test and evaluation

Cork, Ireland, Oct. 1st – PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, today announced the introduction of two new prototype packaging platforms to enable the early-stage testing and evaluation of integrated photonic devices. The PIXAPP Grating Coupler Based Generic Packages (PIXAPP-GCP-10 and PIXAPP-GCP-100) are now available to users that […]

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