PIXAPP Director, Prof Peter O’Brien, will be speaking at the PIC Summit Europe 2023. On 7th of November I’ll will give more insights on Heterogeneous Integration.

Future PIC-based systems will require an indium phosphide based laser and a bunch of silicon transistors. This will likely be integrated on a silicon substrate. Technologies and materials will have to be combined, but what is the best option? Will this be done by chiplets, by wafer or die bonding, or maybe even monolithically? In this session we will discuss the pros and cons of various heterogeneous integration techniques. We will also discuss to which extent the application is playing a role for the choice of technology.

The PIC Summit Europe is Europe’s influential event for the photonic chip industry. Leading lights from the industry share knowledge and discuss all the latest developments from across the photonic chip industry and beyond.

PIC Summit Europe will offer a rich program – featuring keynotes from trailblazers in the PIC domain, semiconductor executives, investors, and OEMs innovating with this emerging technology. Expect two full days dedicated to inspiration, collaboration, and innovation.

Please use this code to get a 15% discount: PeterOBrienPIC15. Go to https://www.picsummiteurope.com/ to get your ticket.