PIXAPP general meeting #5, organized by Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute, HHI in Berlin on October 24 – 25, 2018, went successfully. […]
PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.
PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.
The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.
PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.
Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.
PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.
PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.
PIXAPP has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.
PIXAPP will reinforce the European Industry working on Photonic Integrated Circuits by providing the tools to overcome the challenges associated with the packaging and assembly of the chips. The reduction of the costs for large volume manufacturing is one of the goals of PIXAPP. At Lionix International, we believe that the technology for the manufacturing of PICs-based products it is already mature, now it is time to scale-up the production and to reach the mass-markets.
Photonic integrated circuit based products are changing our conception of the world in which, up to now, electronic circuits have been dominant. Now we are facing an urgent need for the development of manufacturing capabilities and the supply chain required to facilitate high-volume production of these devices. PIXAPP Pilot Line is therefore focusing on the development of standards and automated procedures for packaging and assembly of PIC products, to help pave the way for the massive deployment of these devices in many different fields such as telecommunications, healthcare and sensors.
In PIXAPP we are facilitating the path to reach the high manufacturing volume providing the support and guidance from a validated technical group of experts. PIXAPP offers validated design rules and processes for packaging, while also providing design support as users scale their innovations to volume markets in ICT, Biomedical, Sensing and other industries. As the first point of contact in the Gateway, I help the users to get in touch with the right members from our experienced packaging team to develop their ideas.
The PIXAPP Training & Education will provide training around scalable photonic packaging covering:
The PIXAPP Training & Education will service the following audiences:
To know more about the next PIXAPP Advanced Training Programme click here.
PIXAPP presented the technology offered for PIC assembling and packaging at ECOC 2018, the 44th European Conference on Optical Communication, held in Rome from 23rd to 27th of September. PIXAPP also sponsored the ECOC conference with the special talk from Peter O’Brien on “European Open Access Pilot Lines for Integrated Photonics”.