PIXAPP was present at a very exciting meeting organized by EPIC on New Space at the European Space Agency. […]
PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.
PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.
The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.
PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.
The deadline to send us the proposals is closed and requests will no longer be accepted.
Proposals that have been submitted will be reviewed by an internal PIXAPP panel, with the expectation to start approved projects in 2019.
Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.
PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.
PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.
PIXAPP has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.
The PIXAPP Training & Education will provide training around scalable photonic packaging covering:
The PIXAPP Training & Education will service the following audiences:
To know more about the next PIXAPP Advanced Training Programme click here.
PIXAPP Pilot Line was present at EPIC World Photonics Technology Summit in Berlin last week. […]
The International Electronics Manufacturing Initiative (iNEMI) is organizing a cooperative program to demonstrate expanded-beam single-mode fiber optic array connectors suitable for connections to photonic integrated circuit (PIC) modules. […]
Peter O’Brien, Director of European Photonic Packaging Pilot Line and Head of Group, Photonics Packaging, Tyndall National Institute presented PIXAPP Pilot Line and the global packaging challenges […]
The PIXAPP Pilot Line for Photonic Packaging and Assembly is pleased to announce that it will soon be making its Building Block Reference PICs available to interested parties outside of the consortium. […]