To know more about the next PIXAPP Advanced Training Programme click here

ABOUT PIXAPP

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PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.

PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.

The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.

PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.

UPCOMING EVENTS

TECHNOLOGY

Overview

Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.

PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.

Capabilities

PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.

PIXAPP  has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.

OPTICAL PACKAGING

Fiber to Grating Coupler
Fiber to Edge Coupler
PIC to PIC Coupling
Photonic Wirebonds
Optical Interposers

ELECTRICAL PACKAGING

DC/RF Wirebonds
Flip Chip Bonding
RF Ceramics
RF PCBs
GSG/GSSG Package Designs

THERMO-MECHANICAL PACKAGING

TEC/Thermistor Integration
TEC Controller
Heat Spreader
Injection Molded Microfluidics
Bio-functional Spotting

TEST & RELIABILITY

Optical
Electrical
Environmental Stress
Failure Analysis

TRAINING

The PIXAPP Training & Education will provide training around scalable photonic packaging covering:

  • PIC Device & Package Design
  • PIC Fabrication
  • PIC Assembly and Packaging
  • PIC Testing, Product Reliability and Failure Analysis
  • PIC Application Case Studies
  • Additional credits with Lecture Courses for Masters & Ph.D Students

The PIXAPP Training & Education will service the following audiences:

Industry

  • Industry developing PIC products and using PIC technologies
  • Industry planning to establish in-house PIC packaging manufacturing facilities
  • Industry planning to outsource PIC packaging manufacturing and design
  • New industry entrants to PIC packaging technologies, including non-photonic experts

To know more about the next PIXAPP Advanced Training Programme click here.

Academic & Research

  • Researchers developing PIC based products or innovations
  • Researchers interested in packaging manufacturing, assembly & design
  • Academics interested in PIC packaging technologies

To know more about the next PIXAPP Advanced Integrated Photonic Education Programme, click here.

NEWS

PIXAPP at EPIC Meeting on Wafer Level Optics

PIXAPP at EPIC Meeting on Wafer Level Optics

PIXAPP Pilot line was one of the sponsors at the EPIC Meeting on Wafer Level Optics at SUSS MicroOptics on 7-8 Nov in Neuchâtel, Switzerland. […]

PIXAPP at EPIC Meeting on LIDAR Technologies for Automotive

PIXAPP at EPIC Meeting on LIDAR Technologies for Automotive

PIXAPP Pilot line was present at the EPIC Meeting on LIDAR Technologies for Automotive at Anteryon from 30-31 October 2019 at Eindhoven, The Netherlands. […]

PIXAPP at EPIC Meeting on VCSELs

PIXAPP at EPIC Meeting on VCSELs

PIXAPP Pilot line was one of the key sponsors at EPIC Meeting on VCSELs Technology and Applications at Sony on 17-18 October, 2019 […]

PIXAPP Pilot line at ECOC 2019

PIXAPP Pilot line at ECOC 2019

PIXAPP Pilot line was once again exhibiting at ECOC exhibition 2019, which was held from 22-25 September in Dublin. […]

PIXAPP Symposium at ECOC 2019, Dublin

PIXAPP Symposium at ECOC 2019, Dublin

PIXAPP  Symposium on Photonic Integrated Circuit Manufacturing – Challenges and Solutions was a successful meeting at ECOC 2019.  […]

CONTACT

CONTACT US

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VISIT US

PIXAPP Gateway

Lee Maltings Complex, Cork T12R5CP, Ireland

Phone: +353 (0)21 234.63.08

Email: info@pixapp.eu

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