ABOUT PIXAPP

PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.

PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.

The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.

PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.

UPCOMING EVENTS

TECHNOLOGY

Overview

Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.

PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.

Capabilities

PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.

PIXAPP  has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.

TRAINING

The PIXAPP Packaging Academy will provide training around scalable photonic packaging covering:

  • PIC Fabrication for Packaging
  • PIC Device & Package Design
  • PIC Assembly & Packaging
  • PIC & Product Reliability
  • PIC Application Case Study

The PIXAPP Packaging Academy will service the following audiences:

  • Industry developing / using PIC products & technologies
  • Industry planning to establish in-house PIC manufacturing
  • Industry planning to outsourcing PIC manufacturing
  • New industry entrants to PIC technologies (non-experts)

NEWS

PIXAPP at Medtec Europe 2018

PIXAPP at Medtec Europe 2018

PIXAPP was present with a booth at Medtec Europe 2018, last 17-19 April in Stuttgart. We had also a presentation about the European Industry in Biophotonics: towards the next generation of medical devices given by Ana González, R&D Manager at EPIC and PIXAPP Dissemination Manager.

PIXAPP at Sensors Europe 2018

PIXAPP at Sensors Europe 2018

PIXAPP was at Sensors Europe 2018, in Berlin, last 11-12 of April. It was a great show with lots of contacts and potential users for the Pilot Lines.

PIXAPP at PIC International Conference 2018

PIXAPP at PIC International Conference 2018

We are glad that PIXAPP was present at PIC International Conference 2018. We were there with a booth, PIXAPP was presented by its coordinator, Peter O’Brien, and was sponsoring the EPIC VIP Party.

[…]

PIXAPP at OFC 2018

PIXAPP at OFC 2018

We are glad that PIXAPP was present at OFC 2018. We were there with a booth, sponsoring the OIDA Workshop, the Photonic Integration Workshop, and the EPIC VIP Networking Reception.

[…]

FREE Webinar now online

FREE Webinar now online

FREE Webinar now online.

Photonics Integrated Circuits Packaging and Assembly: PICs basis and applications.

Click here to view

CONTACT

CONTACT US

VISIT US

PIXAPP Gateway

Lee Maltings Complex, Cork T12R5CP, Ireland

Phone: +353 (0)21 234.63.08

Email: info@pixapp.eu

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