To know more about the next PIXAPP Advanced Training Programme click here

ABOUT PIXAPP

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PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.

PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.

The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.

PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.

UPCOMING EVENTS

TECHNOLOGY

Overview

Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.

PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.

Capabilities

PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.

PIXAPP  has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.

OPTICAL PACKAGING

Fiber to Grating Coupler
Fiber to Edge Coupler
PIC to PIC Coupling
Photonic Wirebonds
Optical Interposers

ELECTRICAL PACKAGING

DC/RF Wirebonds
Flip Chip Bonding
RF Ceramics
RF PCBs
GSG/GSSG Package Designs

THERMO-MECHANICAL PACKAGING

TEC/Thermistor Integration
TEC Controller
Heat Spreader
Injection Molded Microfluidics
Bio-functional Spotting

TEST & RELIABILITY

Optical
Electrical
Environmental Stress
Failure Analysis

TRAINING

The PIXAPP Training & Education will provide training around scalable photonic packaging covering:

  • PIC Device & Package Design
  • PIC Fabrication
  • PIC Assembly and Packaging
  • PIC Testing, Product Reliability and Failure Analysis
  • PIC Application Case Studies

The PIXAPP Training & Education will service the following audiences:

  • Industry developing PIC products and using PIC technologies
  • Industry planning to establish in-house PIC packaging manufacturing facilities
  • Industry planning to outsource PIC packaging manufacturing and design
  • New industry entrants to PIC packaging technologies, including non-photonic experts

To know more about the next PIXAPP Advanced Training Programme click here.

NEWS

Survey: Single-Mode Edge vs. Vertical Coupling to PICs

Survey: Single-Mode Edge vs. Vertical Coupling to PICs

The International Electronics Manufacturing Initiative (iNEMI) is organizing a cooperative program to demonstrate expanded-beam single-mode fiber optic array connectors suitable for connections to photonic integrated circuit (PIC) modules. […]

PIXAPP Pilot Line at World Technology Mapping Forum 2019

PIXAPP Pilot Line at World Technology Mapping Forum 2019

Peter O’Brien, Director of European Photonic Packaging Pilot Line and Head of Group, Photonics Packaging, Tyndall National Institute  presented PIXAPP Pilot Line and the global packaging challenges  […]

PIXAPP Pilot Line’s Building Block Reference PICs are now available.

PIXAPP Pilot Line’s Building Block Reference PICs are now available.

The PIXAPP Pilot Line for Photonic Packaging and Assembly is pleased to announce that it will soon be making its Building Block Reference PICs available to interested parties outside of the consortium. […]

PIXAPP at MedTecLive, Nürnberg, Germany

PIXAPP at MedTecLive, Nürnberg, Germany

PIXAPP Pilot Line participated at MedTecLive 2019, Nürnberg, Germany – one of the leading medical technology exhibition and summit. PIXAPP Pilot line highlighted the awareness of Packaging of […]

PIXAPP at EPIC Meeting on Automation Tools for Packaging and Testing

PIXAPP at EPIC Meeting on Automation Tools for Packaging and Testing

A keynote presentation on packaging of integrated photonic devices and scale up through PIXAPP pilot lines was given by Peter O’Brien, Director of European Photonic Packaging Pilot Line and […]

CONTACT

CONTACT US

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VISIT US

PIXAPP Gateway

Lee Maltings Complex, Cork T12R5CP, Ireland

Phone: +353 (0)21 234.63.08

Email: info@pixapp.eu

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