PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.

PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.

The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.

PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.



Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.

PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.


PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.

PIXAPP  has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.


The PIXAPP Packaging Academy will provide training around scalable photonic packaging covering:

  • PIC Fabrication for Packaging
  • PIC Device & Package Design
  • PIC Assembly & Packaging
  • PIC & Product Reliability
  • PIC Application Case Study

The PIXAPP Packaging Academy will service the following audiences:

  • Industry developing / using PIC products & technologies
  • Industry planning to establish in-house PIC manufacturing
  • Industry planning to outsourcing PIC manufacturing
  • New industry entrants to PIC technologies (non-experts)


PIXAPP at Compamed High-Tech Forum by IVAM

PIXAPP at Compamed High-Tech Forum by IVAM


Ray Burke, from Tyndall National Institute, gave a talk about Transforming Photonic Components into Photonic Devices for Medical Applications, during the EPIC Session at the Compamed High-Tech Forum by IVAM, the past 14th of November in Düsseldorf (Germany).


Pilot Line Workshop at IEEE Sensors

Pilot Line Workshop at IEEE Sensors

The Pilot Lines in Photonics are going to foster the next industrial revolution, optical technologies will play a lead role. Find out how the Pilot Lines will impact your business, come to the free tutorial on 29 October (Track A: Photonics, 9:30-12:30) at the IEEE Sensors in Glasgow, Scotland. […]

Pilot Lines for packaging standards at ESREF

Pilot Lines for packaging standards at ESREF

MIRPHAB and PIXAPP Pilot Lines were presented at the 28th European Symposium on Reliability of Electron Devices, Failure Physics, and Analysis (ESREF) in Bordeaux, France (Sep 25-28). […]

PIXAPP at ECOC in Goteborg

PIXAPP at ECOC in Goteborg

Peter O’Brien presented “What does it take to drive down the cost of silicon PIC packaging” at ECOC, the largest conference on optical communication in Europe. The conference took place on 17-21 September in Goteborg.

The Pilot Lines at the GFP

The Pilot Lines at the GFP

Jean-Marc Fedeli (LETI, France) presented The Pilot Lines in Photonics at the International Conference on Group IV Photonics (GFP) in Berlin, 23-25 August. […]




PIXAPP Gateway

Lee Maltings Complex, Cork T12R5CP, Ireland

Phone: +353 (0)21 234.63.08

Email: info@pixapp.eu