ABOUT PIXAPP

PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.

PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.

The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.

PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.

TECHNOLOGY

Overview

Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.

PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.

Capabilities

PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.

PIXAPP  has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.

TRAINING

The PIXAPP Packaging Academy will provide training around scalable photonic packaging covering:

  • PIC Fabrication for Packaging
  • PIC Device & Package Design
  • PIC Assembly & Packaging
  • PIC & Product Reliability
  • PIC Application Case Study

The PIXAPP Packaging Academy will service the following audiences:

  • Industry developing / using PIC products & technologies
  • Industry planning to establish in-house PIC manufacturing
  • Industry planning to outsourcing PIC manufacturing
  • New industry entrants to PIC technologies (non-experts)

NEWS AND EVENTS

PIC International

PIC International

Pixapp will be present as a Gold Sponsor at PIC International, 10-11 April, in Brussels, Belgium.

[…]

Pilot Lines Executive Breakfast at Photonics West

Pilot Lines Executive Breakfast at Photonics West

Full room of top representatives in companies working in Photonics at the Pilot Lines Executive Breakfast @Photonics West.

 

Webinar on Photonic Integrated Circuits Packaging and Assembly: PICs basis and applications

Webinar on Photonic Integrated Circuits Packaging and Assembly: PICs basis and applications

23 February 2018, 15:00 CET

Free Webinar on Photonic Integrated Circuits Packaging and Assembly: PICs basis and applications 

[…]

Medtec Europe 2018

Medtec Europe 2018

PIXAPP will be present at Medtec Europe booth #9B32 Hall 9
Pilot Lines Newsletter “A Direct Route to Reach the Market for Photonics Products”

Pilot Lines Newsletter “A Direct Route to Reach the Market for Photonics Products”

We are pleased to launch the first Pilot Lines Newsletter, find the last updates of our activities. Follow us to know more!
http://mailchi.mp/cf9041ece48c/pilot-line-quarterly-update

CONTACT

VISIT US

CONTACT US

PIXAPP Gateway

Lee Maltings Complex, Cork T12R5CP, Ireland

Phone: +353 (0)21 234.63.08

Email: info@pixapp.eu

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