PIXAPP, in partnership with AIM Photonics, will hold a Special Session on PIC packaging and integration at ECOC 2023, in Glasgow on October 5th 2023.

This workshop brings together leading industry and academic speakers who will present their vision on how to address existing and emerging packaging challenges.

Speakers will address topics including packaging materials, equipment and automation, packaging assembly and process flows, design rules and standardisation, and collaboration with device foundries for improved management of the total manufacturing ecosystem.

More information on this workshop, here.