Category: General

PhotonicLEAP, a European Horizon 2020 collaborative research project, has been awarded over €5 million Euros in funding from the European Commission to develop disruptive technologies that will drive down the cost of integrated photonic packaging and test processes. PhotonicLEAP will develop disruptive wafer-level PIC module integration, packaging and test technologies which will reduce the costs […]

PIXAPP will be exhibiting at Virtual MedtecLIVE & SUMMIT on 20 – 22 April 2021. Visit us to know more about PIXAPP’s capabilities for the medical market, and how we can help your company develop your next-generation of medical devices with photonic integrated circuit packaging and assembly services based on PIXAPP standardised building blocks for […]

PIXAPP will be exhibiting and presenting at AngelTech Virtual III, on 12 April 2021. Visit us to know more about PIXAPP’s offer of Standard Solutions for PIC Packaging. More information and registration HERE.

Join PIXAPP at OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers on 30 – 31 March 2021. The workshop will review emerging trends for data centers and critical challenges embedded photonics must overcome to be considered a viable mass-market technology. Peter O’Brien, PIXAPP Managing Director, will be one of the featured speakers. This […]

PIXAPP will be present at the EPIC Online Technology Meeting on Market Expectations for Specialty Fiber and Fiber Sensors Applications on 18 January at 15:00h CET. Fiber optics sensors conquered nearly every industry: healthcare, automotive, structural monitoring, oil and gas and military to name a few. Each application comes with a set of requirements for […]

PIXAPP will be present at the EPIC Online Technology Meeting on Photonics for Medical Devices on 9 December at 15:00 CET. Photonics technologies bring new approaches to healthcare applications such as diagnostics, therapeutics as well as surgical guidance tools, patient monitoring, and diagnostics devices, etc. This meeting will address the challenges of the development of […]

PIXAPP will be exhibiting at ECOC Exhibition, from 7 to 9 December 2020. ECOC Exhibition is a key meeting place for decision-makers from across the fibre optic communications technology industry. The Pilot Line will be also represented by Peter O’Brien at the EPIC Online TechWatch at ECOC Exhibition on the 9 December from 10:00-12:00 CET. […]

PIXAPP is pleased to announce a call for proposals to support companies develop scalable packaging solutions for their new photonic-based products. Proposals submitted will be reviewed by an internal PIXAPP technical panel, with the expectation to start approved projects in Q1-2021. Click HERE for the main proposal selection criteria and to register for the Pre-Proposal […]

Cork, Ireland, Oct. 1st – PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, today announced the introduction of two new prototype packaging platforms to enable the early-stage testing and evaluation of integrated photonic devices. The PIXAPP Grating Coupler Based Generic Packages (PIXAPP-GCP-10 and PIXAPP-GCP-100) are now available to users that […]