PIXAPP Pre-commercial runs: call for proposals

PIXAPP, the European Photonic Packaging Pilot Line, is pleased to announce a call for proposals to support companies develop scalable packaging solutions for their new photonic-based products. Proposals submitted will be reviewed by an internal PIXAPP panel, with the expectation to start approved projects in Q1-2021.

PIXAPP Prototype Packaging Platform

The PIXAPP Prototype Packaging Platform is designed to provide a cost-effective means of developing prototype Photonics Integrated Circuits (PIC) packages. These packages use standardised electro-opto-mechanical designs which reduces costs and speeds up development and assembly times.

PIXAPP Pilot Packaging Platform

A series of packages based on PIXAPP packaging building blocks have been developed for customers needing pre-commercial series.

Customized packages

PIXAPP offers customised photonic package solutions through its Building Blocks technology, which can be combined and customised for particular applications.
For customers requiring packaging processes outside the scope of these building blocks, PIXAPP can study your case and propose a customised solution from our packaging and assembly partners.