Year: 2020

PIXAPP will be present at the EPIC Online Technology Meeting on Commercial Challenges for Photonics as 5G Booms on 25 January at 15:00 CET. Broadband services at gigabit rates to local destinations, larger areas served at frequencies below 6 GHz, low latency services for local and large datacenters, and connections for Internet of Things (IoT) […]

PIXAPP will be present at the EPIC Online Technology Meeting on Exploring Emerging Applications for Photonic Integrated Circuits on 11 January 2021 at 15:00h CET. Miniaturization, higher performance, unaffected by vibrations, reduced footprint and heat generated are some of the clear benefits of adopting Photonic Integrated Circuits (PICs) for developing new products. This new generation […]

PIXAPP will be exhibiting at virtual.COMPAMED, from 16 to 19 November 2020. Join us to learn how PIXAPP can help your company develop your next-generation of medical devices with photonic integrated circuit packaging and assembly services based on standardized building blocks for medical devices. Photonics Diagnosis Advantages: μL-sample for point of care devices Real-time analysis Low-cost […]

PIXAPP will be present at the EPIC Online Technology Meeting on PIC Testing on 16 November at 15:00 CET. Current challenges in Photonic Integrated Circuit (PIC) product manufacturing are related to the development of testing processes and tools for large scale production. PIXAPP is developing solutions for large volume PIC testing, join us if you want […]

PIXAPP will be present at the EPIC Online Technology Meeting on Quantum Communication & Quantum Key Distribution on 11 November at 15:00 CET. Quantum communication and QKD for a highly secure data transfer is shifting from being laboratory-based scientific research to an indispensable tool in various fields going from networking to banking and ADAS. This […]

PIXAPP will participate at the EPIC Online Technology Meeting on Datacenter Interconnects (in cooperation with COBO and EA) on 4 November at 16:00 CET. The big data era drives interconnection schemes to have low cost, higher energy efficiency, and higher bandwidths, with optical links needing an upgrade to 400Gb/s in the next few years. In […]

Interested to see which technologies will lead the next generation of Free Space Optical devices in which packaging is key? Don’t miss the full discussion of the meeting HERE, where we presented the Open Call to support companies develop scalable packaging solutions for their new photonic-based products.