PIXAPP will participate at the EPIC Online Technology Meeting on Datacenter Interconnects (in cooperation with COBO and EA) on 4 November at 16:00 CET.

The big data era drives interconnection schemes to have low cost, higher energy efficiency, and higher bandwidths, with optical links needing an upgrade to 400Gb/s in the next few years. In this meeting, the needs and expectations for the future manufacturing of photonic devices such as optical switches, transceivers and fiber technology will be discussed.

Join the meeting and discover the packaging services available at PIXAPP for Datacenter applications.

More information and registration HERE.