The quickly growing data traffic stimulated by the emerging services such as data center cloud services, video services and 5G will require the use of technologies that can provide the required power reduction and that are cost-effective. In this context, the miniaturization provided by Photonic Integrated Circuits (PICs) makes them the perfect technology to achieve these goals, as they are fabricated on wafers using a standard Complementary Metal Oxide Semiconductor (CMOS) fabrication process. Additionally, lasers and other functions can be added by using InP PICs and/or hybrid technologies, achieving all the necessary functions in a miniaturized, single platform.
PIC solutions are usually employed for these applications:
- TOSA/ROSA at 100G-200G-400G…
- Optical Switches
- CWDM, DWDM, add/drop MUX components
- Coherent modules
- Tuneable SFP, SFP+, XFP
- FTTH, DCI, AOCs…