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Photonics Integrated Circuits Packaging and Assembly: PICs basis and applications.
PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies.
PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.
The Pilot Line Gateway Office is PIXAPP‘s the easy-access interface for external users, and is located at the Tyndall National Institute, in Ireland. The Gateway is managed by an experienced team, including technical experts to review incoming user requests, and project managers to organise the PIXAPP supply chain.
PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.
Photonic Integrated Circuits (PICs) have the potential to bring the photonic methods and technologies to mass markets in Communications, Healthcare and Security sectors.
PIXAPP provides the full range of assembly and integration technologies needed to package these multifunctional PIC devices, across all stages of manufacturing – from prototyping to medium scale manufacture.
PIXAPP’s broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements.
PIXAPP has the capacity to manage multiple users simultaneously, ensuring fast process cycle-times and minimum delays between incoming user orders and delivery of packaged PICs.
The PIXAPP Packaging Academy will provide training around scalable photonic packaging covering:
The PIXAPP Packaging Academy will service the following audiences:
This year’s OFC, Wednesday March 14th, will feature the fifth workshop on Photonic Integrated Circuits (PICs).
11 March 2018
San Diego Convention Center, Room 20A
San Diego, CA, USA
23 February 2018, 15:00 CET
Free Webinar on Photonic Integrated Circuits Packaging and Assembly: PICs basis and applications