PIXAPP at PIC International 2021
PIXAPP will be exhibiting at PIC International on 9-10 November 2021, in Brussels, Belgium. Visit us to know more about PIXAPP’s offer of Standard Solutions for PIC Packaging. More information and registration HERE
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PIXAPP at Meeting on Automated Packaging & Testing of Photonic Integrated Circuits
PIXAPP’s Managing Director, Peter O’Brien, will present at the EPIC Online Technology Meeting on Automated Packaging & Testing of Photonic Integrated Circuits on 4 October at 15:00 CEST. In this meeting, key players in the packaging field will discuss the adoption of standards, packaging requirements for new applications and the development of faster and cost-effective […]
PIXAPP at Meeting on Head-Up Displays: from 2D to AR
The development of systems for augmented reality visualisation brings a number of photonic challenges to the table. PIXAPP will participate at the EPIC Online Technology Meeting on Head-Up Displays: from 2D to AR to identify the role of integrated circuits in these systems and which are the processes for packaging and assembly involved. Join us […]
PIXAPP at ECOC Exhibition 2021
PIXAPP will be exhibiting at ECOC Exhibition, from 13 to 15 September 2021, in Bordeaux, France. ECOC Exhibition is a key meeting place for decision-makers from across the fibre optic communications technology industry. Visit us at booth #1110 in hall 1, to know more about the high-speed gold box offered by the PIXAPP Pilot Packaging Platform, […]
PIXAPP at Meeting on Spectroscopy and Imaging for Process Monitoring
Non-invasive technologies to real-time monitor industrial processes are key for proper automation and production optimisation. PIXAPP will attend the EPIC Online Technology Meeting on Spectroscopy and Imaging for Process Monitoring to discover new solutions for process monitoring and how PIXAPP can help with the packaging and assembly of these systems. Join us on 13 September […]
PIXAPP at Meeting on New Developments in FMCW LIDAR
The possibility of developing PIC-based LIDAR systems is very attractive for the automotive industry due to the reduction in size and price, compared to traditional systems. PIXAPP will be present at the EPIC Online Technology Meeting on New Developments in FMCW LIDAR to explore the needs and challenges of the industry for packaging FMCW LIDAR. […]
PhotonicLEAP awarded over €5m in European funding to develop disruptive low-cost photonic packaging and test technologies
PhotonicLEAP, a European Horizon 2020 collaborative research project, has been awarded over €5 million Euros in funding from the European Commission to develop disruptive technologies that will drive down the cost of integrated photonic packaging and test processes. PhotonicLEAP will develop disruptive wafer-level PIC module integration, packaging and test technologies which will reduce the costs […]
Webinar: European Photonics Manufacturing Services Funded by EC
On 30 June 2021 at 14:30 CEST, Peter O’Brien will present PIXAPP at the Webinar: European Photonics Manufacturing Services Funded by EC. The event will introduce some preeminent EU acceleration initiatives to the widest possible public of small- to medium-size companies (SMEs) ready for these opportunities to create high value-added products in numerous application areas […]
PIXAPP at Meeting on Medical Devices
Join us on 14 June at 15:00 CEST during the EPIC Online Technology Meeting on Medical Devices for Surgical Procedures, where Peter O’Brien will present PIXAPP Biosensor Package. PIXAPP offers Pilot Production of disposable packages for affinity-based biosensors, check more HERE. More information and registration for the meeting HERE.
PIXAPP at OFC Exhibition 2021
PIXAPP will be exhibiting at Virtual OFC from 7 to 11 June 2021. Visit us to know more about the high-speed gold box offered by the PIXAPP Pilot Packaging Platform, and other customized packaging solutions, go to the market faster! Visit our booth HERE.