PhotonicLEAP, a European Horizon 2020 collaborative research project, has been awarded over €5 million Euros in funding from the European Commission to develop disruptive technologies that will drive down the cost of integrated photonic packaging and test processes.
PhotonicLEAP will develop disruptive wafer-level PIC module integration, packaging and test technologies which will reduce the costs of PIC production by over 10 times, revolutionising existing applications and creating completely new markets.
PhotonicLEAP will use these disruptive technologies to produce a revolutionary Surface Mount Technology (SMT) PIC package, which for the first time incorporates multiple optical and electrical connections. The project will validate these technologies through state-of-the-art demonstrators, including a high-speed optical communication module and a medical device for cardio-vascular diagnostics. Furthermore, the technologies will be implemented by PIXAPP, for future commercialisation. PIXAPP has an extensive and growing user-base across multiple markets.
Read the full press release HERE.