PIXAPP Packaging Solutions are based on Scalable and Validated Process Building Blocks

The development of standardised photonic packaging processes is key to increasing access and reducing the cost of manufacturing photonic devices. PIXAPP offers a menu of packaging processes to its users which cover optical, electrical, thermal, mechanical, and micro-fluidic processes. These Building Blocks allow standardised manufacturing processes to be used across the entire supply chain. PIXAPP works with design houses, foundries, companies providing packaging services and components, and companies providing automation tools, to ensure these building blocks are suitable for pilot level assembly.

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Optical Packaging Building Blocks

PIXAPP offers a wide variety of packaging building blocks for optical connections to Photonic Integrated Circuits (PICs). These building blocks are validated and scalable processes that are suitable for pilot scale production at the facilities of PIXAPP partners.

The available optical building blocks include:

  • Fibre array attach to SOI and SiN PICs (grating couplers)
  • Fibre array attach to SOI, SiN and InP PICs (edge couplers)
  • Optical Interposers on SOI and SiN
  • Photonic Wire Bonds
  • 3D Printed Micro-Lenses
  • LIFT Micro-Lenses on SOI and SiN
  • Hybrid integrated laser sources (1310nm)

Electrical Packaging Building Blocks

PIXAPP offers a wide variety of packaging building blocks for electrical connections to Photonic Integrated Circuits (PICs). These building blocks are validated and scalable processes that are suitable for pilot scale production at the facilities of our PIXAPP partners.

The available electrical building blocks include:

  • Ball Bonding (DC applications)
  • Ribbon and Wedge Bonding (RF applications)
  • Die and Wafer Level Flip Chip Bonding
  • Die and Wafer Level Solder Jetting (50um spheres)
  • High Speed PCB Design
  • LTCC Carrier Design and Manufacture

Thermo-Mechanical Packaging Building Blocks

PIXAPP offers a wide variety of packaging building blocks for thermo-mechanical interfacing to Photonic Integrated Circuits (PICs). These building blocks are validated and scalable processes that are suitable for pilot scale production at the facilities of our PIXAPP partners.

The available thermo-mechanical building blocks include:

  • Generic DC and RF Packages with integrated thermo-electric coolers
  • Custom heat spreaders for PIC cooling
  • Thermal imaging
  • TEC optimisation

Micro-Fluidic Packaging Building Blocks

PIXAPP offers several packaging building blocks for micro-fluidic interfacing to Photonic Integrated Circuits (PICs). These building blocks are validated and scalable processes that are suitable for pilot scale production at the facilities of our PIXAPP partners.

The available micro-fluidic building blocks include:

  • Custom micro-fluidic cartridge design and manufacture
  • Stable gluing process for PIC-cartridge assembly
  • Scalable assembly process for PIC-cartridge integration
  • Generic cartridge and fibre holder for rapid prototyping (passively aligned)