PIXAPP launches new prototype packaging platforms for early-stage photonic device test and evaluation

Cork, Ireland, Oct. 1st – PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, today announced the introduction of two new prototype packaging platforms to enable the early-stage testing and evaluation of integrated photonic devices. The PIXAPP Grating Coupler Based Generic Packages (PIXAPP-GCP-10 and PIXAPP-GCP-100) are now available to users that […]

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PIXAPP at EPIC OTM on New Pluggable Transceivers

PIXAPP participated in the EPIC Online Technology Meeting on New Pluggable Transceivers on 8 September 2020. Manufacturing, cost reduction, and reduction of heat generated were hot topics discussed at the meeting. PIXAPP can help companies to develop standard processes for optical and thermal packaging, helping to ramp the volumes in the most cost-effective way. To […]

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PIXAPP at EPIC OTM on Co-packaged Optics

Peter O’Brien participated in the EPIC Online Technology Meeting on Co-packaged Optics on 8 June 2020. There were interesting discussions with the key players of the industry about grating vs. edge coupling, standards and automation processes such as passive vs active alignment for the ramp-up volumes. You can watch the full discussion HERE.

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