PIXAPP at OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

Join PIXAPP at OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers on 30 – 31 March 2021.

The workshop will review emerging trends for data centers and critical challenges embedded photonics must overcome to be considered a viable mass-market technology. Peter O’Brien, PIXAPP Managing Director, will be one of the featured speakers.

This OIDA workshop will be the 10th in a series on topics important to the commercialization of new optical communications components and equipment, particularly for the manufacture of integrated photonics as the next platform for optical communications.

More information and registration HERE.