PIXAPP will be present at the EPIC Online Technology Meeting on Roadmap 2021 for Co-packaged Optics (in cooperation with COBO & EA) on 3 March at 15:00h CET.

Co-packaging optics have the potential to reduce the length of the switch-optic interconnects lowering the power consumption of the switch-optic electrical I/O which will be key to support greater networking demands. The requirements for co-packaged optic assemblies for network switch applications will be discussed in this meeting, with a special focus on the elaboration of a roadmap for co-packaged optics and collaborations between the supply chain to achieve the requirements for volume manufacturing of these devices.

Do you need help to package your PIC-based device? Check the PIXAPP offer for packaging building blocks based on standard solutions.

More information and registration for the meeting HERE.

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