The PIXAPP Prototype Packaging Platform is designed to provide a cost-effective means of developing prototype PIC packages. These packages use standardised electro-opto-mechanical designs which reduces costs and speeds up development and assembly times.

Grating Coupler Based Generic Package

Package Description

For PICs with <22 DC electrical connections, “off-the-shelf” PCBs are available for rapid prototyping using the PIXAPP-GCP-10 design. For PICs with larger electrical and optical port numbers, the more flexible PIXAPP-GCP-100 design is available. Contact PIXAPP to learn more about the design rules for using these packages.


  • Prototyping PICs for Telecom and Datacom Applications Read more
  • Prototyping PICs for LiDAR Applications Read more
  • Prototyping PICs for Sensing Applications Read more
  • Prototyping PICs from Silicon or Silicon Nitride MPW Services

Contact PIXAPP for a quotation