PIXAPP Prototype Packaging Platform
The PIXAPP Prototype Packaging Platform is designed to provide a cost-effective means of developing prototype Photonics Integrated Circuits (PIC) packages. These packages use standardised electro-opto-mechanical designs which reduces costs and speeds up development and assembly times.
PIXAPP offers customised photonic package solutions through its Building Blocks technology, which can be combined and customised for particular applications.
For customers requiring packaging processes outside the scope of these building blocks, PIXAPP can study your case and propose a customised solution from our packaging and assembly partners.