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PIXAPP Workshop at EPIC Meeting on Automation Tools for Packaging and Testing

May 23 @ 12:00 pm - May 24 @ 4:00 pm

PIXAPP will hold a dedicated session on Packaging at the EPIC Meeting on Automation Tools for Packaging and Testing, where Peter O’Brien will give a keynote talk and the partners of the consortium will present the capabilities of the Pilot Line.

The purpose of the meeting is to bring together equipment manufacturers and companies investing or interested in the further automation of their high precision manufacturing and testing lines, to discuss the production of optoelectronic components and modules (Silicon Photonics, PICs, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP) and to identify bottlenecks in process automation for any industry (HPLD manufacturing, fiber-optics and opto-electronics, medical technology, security and military applications, R&D, telecommunications, and others) and volume demand.

Registration open here.



May 23 @ 12:00 pm
May 24 @ 4:00 pm