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PIXAPP Advanced Training Programme

January 13, 2020 - January 17, 2020

PIXAPP is pleased to announce the roll out of its advanced PIC design, fabrication and packaging training program that will take place from 13 – 17 January 2020.

With the advance in photonic technologies, the ability to integrate photonic devices with different functionalities into a miniaturized chip at low cost is significant. Photonic Integrated Circuit (PIC) technologies enable the practical use of photonics in different industries ranging from data communication, healthcare, automobile, and many others.

This unique industry training programme provides attendees with access to state-of-the-art facilities and equipment, and a comprehensive set of dedicated lectures and technical mentoring. The programme will be delivered by international experts recognized in the field and coming from PIXAPP European Consortium, ensuring attendees gain a deep understanding of PIC technologies and critical PIC packaging manufacturing processes.  The 5-day interactive training will cover fundamental technical skills in PIC packaging design, fabrication, assembly, and reliability testing through a series of lecture-based and lab-based training. Please see HERE the training section.

For further information see the training brochure HERE or contact at info@pixapp.eu

Details

Start:
January 13, 2020
End:
January 17, 2020
Website:
https://pixapp.eu/wp-content/uploads/2019/08/PIXAPP-Training-Brochure-January-13-to-17-2020.pdf

Venue

Tyndall National Institute
Lee Maltings Complex Dyke Parade Cork, T12 R5CP Ireland + Google Map