PIXAPP modules in the market

May 21st, 2020 Posted by Uncategorized No Comment yet

PIXAPP standard packages are ready to be commercialized, increasing the level of standardization in photonic assemblies.

By using the PIXAPP building blocks menu, the design and manufacturing cost of customized packages can be significantly reduced.

This PIXAPP standard package involves the assembly of a silicon photonics integrated circuit (PIC) onto an electronic printed circuit board that has an integrated thermoelectric cooler (TEC) mounted below it. For ease of assembly, the optical fiber array is connected using a grating coupler with alignment loops. A modified version of this design is available which allows for edge coupled photonic chip assembly.

To find out how we can package your photonic integrated circuit, contact us!

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