PIXAPP Pilot line at ECOC 2019

October 1st, 2019 Posted by Uncategorized No Comment yet

PIXAPP Pilot line was once again exhibiting at ECOC exhibition 2019, which was held from 22-25 September in Dublin. PIXAPP Pilot line booth displayed the PIXAPP Packaging Building Blocks for PICs during the exhibition, along with the reference PICs for biosensor demonstrator and other packages for Datacom. The main objective is to reduce the cost of packaging. PIXAPP Pilot line was exhibited at Booth No. 402 along with JePPIX, PASSION and EPIC-European Photonics Industry Consortium.

PIXAPP was also one of the key sponsors at the yearly EPIC VIP Networking reception. With an attendance of more than 150 delegates, EPIC VIP Networking Reception at ECOC exhibition was buzzing with interesting conversations and ideas. The evening brought together key experts and leaders from the photonics industry to discuss, network and collaborate for the future, over some delicious food and drinks. Hosted every year, the EPIC VIP Networking Reception is the most sought after networking events at ECOC to encourage collaborations and partnerships among the members and guest from the photonics industry.

PIXAPP Symposium on Photonic Integrated Circuit Manufacturing – Challenges and Solutions was a successful meeting held on 22nd September, with an attendance of more than 120 delegates. Read more on the meeting here.

The entire week at ECOC has been very interesting for PIXAPP Pilot Line to meet and interact with companies and industry colleagues. It was overall a great meeting platform for PIXAPP Pilot line and to introduce the Packaging Building Blocks for PICs to the industry.

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