The International Electronics Manufacturing Initiative (iNEMI) is organizing a cooperative program to demonstrate expanded-beam single-mode fiber optic array connectors suitable for connections to photonic integrated circuit (PIC) modules. This program is the second phase of a more extended program, the first phase of which successfully demonstrated single-mode expanded-beam connectors for backplane and front panel applications.
The first phase of the project assessed the benefits of expanded-beam connectors for fiber-to-fiber connections in systems using single-mode fiber, successfully demonstrating single-mode expanded-beam connectors for fiber-to-fiber connections in backplane and front panel applications. Single-mode connectors with fiber-to-fiber insertion losses of less than 0.7 dB, and return losses of better than 30 dB, were demonstrated. Serial concatenation of up to 5 connections produced no eye degradation at data rates of 25 Gbps.
To help us clarify what key performance and design characteristics are important for developing a demonstration vehicle of the connector for the PIC module interface, we are asking for your input through an industry-wide survey comparing single-mode edge coupling versus vertical coupling to PICs.
We would very much appreciate your contributions to this survey as we want to ensure that the demonstration vehicle reflects the future and anticipated needs of our industry.
All information provided in the survey will be treated as confidential and only aggregated data will be made public. You may answer anonymously or provide your contact information. All respondents who share their contact information will receive an invitation to a webinar summarizing the survey results.
Responses will only be reviewed by the project leaders: Terry Smith, 3M, Tom Marrapode, Molex, Sean Foley, AFT, Peter O’Brien, Tyndall, Tom Brown, Rochester University and Grace O’Malley, iNEMI
Thank you in advance for taking the time to contribute to this program.
Take the survey here: https://bit.ly/2NK2wg9