PIXAPP Pilot Line at World Technology Mapping Forum 2019

June 18th, 2019 Posted by Uncategorized 1 comment

Peter O’Brien, Director of European Photonic Packaging Pilot Line and Head of Group, Photonics Packaging, Tyndall National Institute  presented PIXAPP Pilot Line and the global packaging challenges  for integrated photonics at World Technology Mapping Forum 2019 on 13th June in Berlin, Germany.

The presentation highlighted the current status of packaging technologies for integrated photonics, how packaging fits within the overall integrated photonics ecosystem, especially in relation to manufacturing, and key features of the packaging technology roadmap. The talk also reviewed international initiatives to address scale-up of packaging technologies, in particular PIXAPP Pilot Line which aim to address the transition from laboratory prototypes to low-to-medium volume manufacturing.

The goal of this international gathering was to update and discuss the first draft of Integrated Photonic Systems Roadmap – International (IPSR-I), looking ahead to the global technology needs as far ahead as 2040.

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One comment

PIxapp made an excellent contribution to this year’s WTMF in Berlin. On the results page at http://www.wtmf.eu/news1901/keynotes/ you will find Peter’s presentation at https://vimeo.com/342533123 . There are also some very important comments about photonics packaging in the subsequent discussion. https://vimeo.com/342535868 . Finally, the introduction video explains why PIXAPP is involved in https://vimeo.com/337034101. You may want to add these links or embed the videos on your own site.

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