The PIXAPP Pilot Line for Photonic Packaging and Assembly is pleased to announce that it will soon be making its Building Block Reference PICs available to interested parties outside of the consortium. The PICs provide standardised optical, electrical and thermal interfaces across the main photonic platforms currently in use: SOI, SiN and InP. These reference PICs will provide an ideal vehicle for test equipment and assembly providers to validate their technologies with respect to the PIXAPP packaging building blocks, while also encouraging companies adopt the standards developed within PIXAPP.
For more information please contact:
PIXAPP Dissemination Manager and R&D Manager at EPIC