PIXAPP at EPIC Meeting on Automation Tools for Packaging and Testing

May 28th, 2019 Posted by Uncategorized No Comment yet

A keynote presentation on packaging of integrated photonic devices and scale up through PIXAPP pilot lines was given by Peter O’Brien, Director of European Photonic Packaging Pilot Line and Head of Group, Photonics Packaging, Tyndall National Institute and  at EPIC Meeting on Automation Tools for Packaging and Testing held at ASM AMICRA, Regensburg, Germany.

The purpose of the meeting was to bring together equipment manufacturers and companies interested in automation of high precision manufacturing and testing lines and to discuss the integration and production of photonic packaging components and identify bottlenecks in process automation for the industry.

The key highlight was the focus on the integrated manufacturing ecosystem where Research, Equipment, Manufacturing and Applications need to work together.

Anna Gonzalez, R&D Manager, EPIC Association presented the PIXAPP pre-commercial run and the call for proposals process to support companies develop scalable packaging solutions for their new photonic-based products.

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