The PIXAPP Advanced Training Program took place from 7th – 11th of January 2019.
With the advance in photonic technologies, the ability to integrate photonic devices with different functionalities into a miniaturized chip at low cost is significant. Photonic Integrated Circuit (PIC) technologies enable the practical use of photonics in different industries ranging from data communication, healthcare, automobile, and many others. This was a unique opportunity to gain advanced knowledge in PIC packaging technologies from internationally recognized experts in the field. The 5-day interactive training covered fundamental technical skills in PIC packaging design, fabrication, assembly, and reliability testing through a series of lecture-based and lab-based training.