September 27th, 2018 Posted by Uncategorized No Comment yet

PIXAPP presented the technology offered for PIC assembling and packaging at ECOC 2018, the 44th European Conference on Optical Communication, held in Rome from 23rd to 27th of September. PIXAPP also sponsored the ECOC conference with the special talk from Peter O’Brien on “European Open Access Pilot Lines for Integrated Photonics”.

PIXAPP was successful at ECOC 2018 gaining more visibility and getting noticed by potential users in the optical communication industry.

The EPIC VIP party, gathering C-level representatives from 137 companies in 28 countries, was also sponsored by PIXAPP. Also, PIXAPP was presented by Ana González from EPIC at the COBO – Consortium for On-Board Optics meeting at ECOC 2018 to many leading players in the telecommunication industry – eg. IBM, Microsoft, Juniper, Celestica, COMMSCOPE.

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