This year’s OFC, Wednesday March 14th, will feature the fifth workshop on Photonic Integrated Circuits (PICs).
The fourth workshop was held at OFC 2017 and had over 375 attendees. Driven by 100Gbps and beyond in long-haul as well as in datacenter, photonic integration is picking up increasing momentum, and is now also being used in sensing, life-sciences, and military applications. Purpose of the workshop is to create a one-stop-shop for everyone interested in photonic integration as it brings together all the key players offering solutions: foundries, simulation software, design houses, packaging, test & measurement, and turn-key solutions. Specific emphasis is on Multi-Project Wafer shuttles (MPWs) plus the accompanying Process Design Kits (PDKs), as they provide an important toolkit to reduce the costs for developing a new chip. The workshop will provide a good overview of the state-of-the-art in PICs, along with food and drinks, and plenty of time to network with the sponsor companies. The workshop is free, but does require advance registration.
5:15 PM – 5:45 PM: Registration, Buffet Opens, Sponsor Tabletops, Networking
5:45 PM – 5:50 PM: Welcome and Introduction
5:50 PM – 6:55 PM: Key Note Presentation “Latest Trends in Photonic Integration and How to Use the PIC Ecosystem to Develop a PIC Cheaper and Faster”
6:55 PM – 7:00 PM: Question & Answer Session
7:00 PM – 7:40 PM: Networking Break with Buffet and Sponsor Tabletops
7:40 PM – 7:50 PM: AIM Photonics Overview, Speaker: Erman Timurdogan (Analog Photonics)
7:50 PM – 8:25 PM: Use Case Presentations by Companies Sharing Their Experiences Using Photonic ICs Speakers: Michael Hochberg, (Elenion), John Bowers (UCSB), Nigel Wing (Derma Lumics), Chris Coleman (Keysight), Andrew Rickman (Rockley Photonics)
8:25 PM – 8:30 PM: Questions & Answers, Wrap-up
Registration open at https://www.7pennies.com/news-events/pic-workshop-ofc-2018/