Monthly Archives: September, 2017

Pilot Lines for packaging standards at ESREF

September 30th, 2017 Posted by Uncategorized No Comment yet

MIRPHAB and PIXAPP Pilot Lines were presented at the 28th European Symposium on Reliability of Electron Devices, Failure Physics, and Analysis (ESREF) in Bordeaux, France (Sep 25-28). (more…)

PIXAPP at ECOC in Goteborg

September 21st, 2017 Posted by Uncategorized No Comment yet

Peter O’Brien presented “What does it take to drive down the cost of silicon PIC packaging” at ECOC, the largest conference on optical communication in Europe. The conference took place on 17-21 September in Goteborg.