PIXAPP targets four key Application Demonstrators, one of which is a Si-PIC DataComm module with hybrid integrated electronics and lasers, as well as a pluggable multi-channel single-mode Fibre-to-PIC connection. (more…)

A group photo of the PIXAPP partners in UCC (University College Cork) during the PIXAPP Kick-Off Meeting in Ireland from 19-20th of January 2016. PIXAPP consists of 18 partners from companies and institutes in Europe. (more…)

PIXAPP – the world’s first open-access pilot-line for the assembly and packaging of PICs (Photonic Integrated Circuits) – had its kick-off meeting on the 19th of January 2016, at the Tyndall National Institute in Cork, Ireland. (more…)