Webinar on Photonic Integrated Circuits Packaging and Assembly: PICs basis and applications

February 6th, 2018 Posted by Uncategorized No Comment yet

23 February 2018, 15:00 CET

Free Webinar on Photonic Integrated Circuits Packaging and Assembly: PICs basis and applications 

Registration already open: https://event.webcasts.com/starthere.jsp?ei=1179920&tp_key=af7c04d9b1&sti=pixapp

Photonic Integrated Circuits (PICs) based products overcome the limitations of actual technologies in the field of telecommunications, medical and industry by offering advanced capabilities such as a reduction in the power consumption, real-time an unatended monitoring of processes, unprecedent sensitivity levels, minituarization capabilities, and the possibility to integrate them in already existing equipment. Currently, PICs based devices have already reached mass markets such as cell phones and their presence in quotidiane products is going to exponentially increase in the upcoming years. We offer here a series of webinars dedicated to the development of PIC products, from technology and applications to packaging and testing. The webinars consist of different talks in which you will have the opportunity to interact with top-level speakers in the field of PICs and packaging. Ateendeers will be able to ask questions and actively participate in the discussion.

The first webinar is focused on the fundamentals of PIC based devices and packaging, Dr. Ana Gonzalez (European Photonics Industry Consortium, EPIC) will offer an overview of the different technologies, EU capabilities and possible applications for PIC products and Dr. Lee Carroll (Tyndall Institute) will talk about packaging and assembly of PICs.


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