PIXAPP Kick-Off Meeting

January 21st, 2017 Posted by Uncategorized 1 comment

PIXAPP – the world’s first open-access pilot-line for the assembly and packaging of PICs (Photonic Integrated Circuits) – had its kick-off meeting on the 19th of January 2016, at the Tyndall National Institute in Cork, Ireland. PIXAPP‘s European partners, from Ireland, Belgium, the Czech Republic, Finland, France, Germany, Italy, the Netherlands, and the United Kingdom, all travelled to Cork, to participate in the two day event.

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